Pre&Post-Simulation Capability

Pre-Simulation Capability

Tools:

  • Via Wizard
  • Generalpurpose3D solvers (time domain and frequency domain)

Information normally available:

  • Board layer stackup
  • Transmission line impedance
  • Design rules (e.g. minimum via distance, via radius)
  • Components footprint
  • Location of components (roughly)
  • Signal specifications (e.g. insertion loss, eye opening)

Analyses:

  • Routing layer –TDR analysis
  • Channel length –eye opening
  • Channel distance –crosstalk

Post-Simulation Capability

Tools:

  • General purpose 3D solvers (time domain and frequency domain)
  • Special PCB solvers (IR Drop analysis, PI analysis, SI FD/TD

Analyses:

  • SI analysis
    1. S-parameters
    2. TDR
    3. Eye diagram
  • IR drop
    1. Current density and voltage drop distribution
  • AC PDN Impedance (noise due to switching)
  • PI analysis
    1. Impedance
  • Decap analysis and optimization
  • Conducted emissions
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