Tools:

• Via Wizard
• Generalpurpose3D solvers (time domain and frequency domain)

Information normally available:

• Board layer stackup
• Transmission line impedance
• Design rules (e.g. minimum via distance, via radius)
• Components footprint
• Location of components (roughly)
• Signal specifications (e.g. insertion loss, eye opening)

Analyses:

• Routing layer –TDR analysis
• Channel length –eye opening
• Channel distance –crosstalk

Post-Simulation Capability

Tools:

• General purpose 3D solvers (time domain and frequency domain)
• Special PCB solvers (IR Drop analysis, PI analysis, SI FD/TD

Analyses:

• SI analysis

1. S-parameters
2. TDR
3. Eye diagram

• IR drop

1. Current density and voltage drop distribution

• AC PDN Impedance (noise due to switching)
• PI analysis

1. Impedance

• Decap analysis and optimization
• Conducted emissions